Midwest Tech Services, Inc. Solutions for Electronic Assembly

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Data Sheet

353 Water Soluble Paste Flux, 10cc Syringe (CASE OF 10)
WS353 paste flux is an organically activated formulation composed of the same basic materials found in WS353 water-soluble solder paste, ensuring its compatibility. WS353 paste flux may be utilized for ball attach, flip chip, die attach, tinning, rework, and other standard paste flux applications. WS353 paste flux offers robust environmental tolerance and printing characteristics, excellent activity, a broad cleaning process window, and compatibility with both tin-lead and lead-free solder alloys. WS353 paste flux also provides an exceptional postprocess cleaning window and is designed to not foam during the cleaning process, even in high pressure wash systems. WS353 offers extended stencil life and tack time.

Price: $178.00

FEATURES AND BENEFITS: High activity level. Improved environmental resistance. Excellent wetting. Extended cleaning window. For ball attach, flip chip, die attach, tinning, and rework applications.

Midwest #: A02-PF-WS353-SC10