HTC01K | HTC - Non-Silicone Heat Transfer Compound (1 kg)
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- Minimum Order Quantity:
- 1 unit
HTC is a non-curing heat transfer paste, designed for use as a thermal interface material. It is recommended where the efficient and reliable thermal coupling of electronic components or heat dissipation between any surfaces are required. HTC is a non-silicone paste, suitable for applications where silicones are prohibited, thus avoiding issues with silicone and low molecular weight siloxane migration.