MTS Part # : E11-EHTC01K
Mfr Part # : HTC01K
Availability : Ships within 1 business day
HTC is a non-curing heat transfer paste, designed for use as a thermal interface material. It is recommended where the efficient and reliable thermal coupling of electronic components or heat dissipation between any surfaces are required. HTC is a non-silicone paste, suitable for applications where silicones are prohibited, thus avoiding issues with silicone and low molecular weight siloxane migration.