MTS Part # : A02-C-275LR-5G
Mfr Part # : 20112
Availability : Contact Us for info.
Features: VOC Exempt According to ASTM D3960-98Lead-Free CompatibleHalide-Free Low Post Process ResiduesBroad Process WindowExcellent WettingPasses IPC SIR-004 BExcellent in Extended Dwell Time : NC275LR is a water-based, halide-free, no-clean liquid flux formulated to offer a very wide process window allowing for extremely good wetting, even to difficult-to-wet materials. NC275LR offers a broad activation range, proving to be an excellent flux for a variety of process parameters and applications, including lead-free wave soldering with tin-silver-copper, tin-silver, tin-copper, and other alloys. NC275LR offers low post-process residues and has proven to reduce preventative maintenance requirements for spray fluxing applications. In addition, NC275LR offers low-fuming and fast solvent evaporation. NC275LR is safe to be left on the circuit board after processing and uncleaned. NC275LR is extremely safe for rework, palletized wave soldering and point-to-point selective soldering. NC275LR is designed to be a no-clean, non-visible residue flux, which can be cleaned if critical to the product application. Application: - NC275LR is ready to use directly from the container for spray systems. - When spray fluxing, it is imperative that proper flux coverage and uniformity be achieved and maintained. A dry flux coating of 500 to 2000 micrograms per square inch is necessary. - When complete nitrogen sealed wave solder equipment is used, it is generally necessary to apply slightly more flux than normal as a result of excess drying due to the extended length of the equipment. Cleaning: NC275LR can be cleaned, if necessary, with water, and enhanced cleaning can be achieved through the use of a saponifier. Deionized water is recommended for the final rinse. A temperature of 38C - 65C (100 - 150F) is sufficient for removing any residues. An in-line or other pressurized spray cleaning system is suggested, but is not required.