MTS Part # : A02-P100C-NC2572-T3-CA8
Mfr Part # : 21215
Availability : Contact Us for info.
Features: RoHS Compliant Vapor Phase CompatibleExcellent Wetting Broad Printing Process WindowLow-Tombstoning12-14 Hour Tack Time Clear Pin-Probe Testable Residue24 Hour Stencil Life - Low Solder Beading : NC257 has been developed to offer extremely broad process windows for printing, wetting and pin-probe testing. The superior wetting ability of NC257 results in bright, smooth and shiny solder joints. It also offers very low post process residues, which remain crystal clear and easily probed even at the elevated temperatures required for todays lead-free alloys. This alloy offers a chemistry developed for use in air reflow, as well as providing slump and humidity tolerances to extend the useable life in facilities where environmental control is not at its optimum. Printing: - Apply sufficient paste to the stencil to allow a smooth, even roll during the print cycle (a bead diameter of 12 to 16 mm ( to inch) is normally sufficient to begin). - Apply small amounts of fresh solder paste to the stencil at controlled intervals to maintain paste chemistry and workable properties. - NC257 provides the necessary tack time and force for todays high speed placement equipment, which will enhance product performance and reliability. - Snap-off distance On Contact 0.00 mm (0.00) - PCB Separation Distance 0.75-2.0 mm (.030-.080) - PCB Separation Speed Slow - Squeegee Pressure 0.10 0.30 kgcm (.6 - 1.7 lbs In.) of blade - Squeegee Stroke Speed 25-50 mmsec. (1-2 in.sec) Reflow Profile: Two unique profile families are depicted below; both can be used in ramp-spike or ramp-soak-spike applications, and they each have similar reflow temperatures. The two profiles differ in where they reach their respective peak temperatures, as well as the time above liquidus (TAL). The shorter profile of the two would apply to smaller assemblies, where as the longer profile would apply to larger assemblies, such as backplanes or high-density boards. The shaded area defines the process window. Oven efficiency, board sizemass, component type and density all influence the final profile for a given assembly. These profiles are starting points, and processing boards with thermal-couples attached is recommended to optimize the process.Compatible Products: - AIM Lead-Free Electropure Solder Bar - NC Paste Flux, No Clean Tacky Flux - NC270 VOC-Free No Clean Spray Flux - NC264-5 No Clean flux SprayFoam - Glowcore No Clean Cored Wire - Epoxy 4044 Chip Bonding Epoxy Cleaning: - NC257 can be cleaned if necessary with saponified water or an appropriate solvent cleaner. - Please refer to the AIM cleaner matrix for a list of compatible cleaning materials. Handling and Storage: - NC257 has a refrigerated shelf life of 6 months at 4C (40F) to 12C (55F). - Allow the solder paste to warm up completely and naturally to ambient temperature (8 hrs.) prior to breaking the seal for use. - Mix the product lightly and thoroughly (1-2 mins. max) to ensure even distribution of any separated material. - Do not store new and used paste in the same container, and reseal any opened containers while not in use. - Replace the internal plug and cap of the 500 gram jars to ensure the best possible seal.