AIM Solder - 21298 | SN62, NC258 NoClean Solder Paste, T3 - 500g Jar

MTS Part # : A02-P62-NC258-T3-J5

Mfr Part # : 21298

Availability : Contact Us for info.

Features: Long Pause-to-Print Capabilities Excellent Wetting, Even Leadless Devices Reduces Voiding Low Post Process Residues RoHS Compliant Passes Bono Testing NC258 has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. NC258 reduces voiding. The superior wetting ability of NC258 results in bright, smooth and shiny solder joints. It also offers very low post process residues, which remain crystal clear even at the elevated temperatures required for todays lead-free alloys.CLEANING Pre-Reflow: AIM DJAW-10 effectively removes NC258 solder paste from stencils while in process. DJAW-10 can be hand applied or used in under stencil wipe equipment. DJAW- 10 will not dry NC258 and will enhance transfer properties. Do not over-apply DJAW-10. Do not apply DJAW-10 to stencil topside. Isopropanol (IPA) is not recommended in process, but may be used as a final stencil rinse. Post-Reflow Flux Residue: NC258 residues can remain on the assembly after reflow and do not require cleaning. Where cleaning is mandated, AIM has worked closely with industry partners to ensure that NC258 residues can be effectively removed with common defluxing agents. Contact AIM for cleaning compatibility information.