MTS Part # : A02-89079
Mfr Part # : 89079
Availability : Contact Us for info.
Features: Specially Engineered for Mycronic Jet Printers Clear Pin-Probe Testable Residue Excellent Wetting, Even Leadless Devices Reduces Voiding Under Micro-BGAs 8-12 Hour Tack Time Vapor Phase Compatible NC257MD solder paste has been specifically developed for Mycronic Jet Printers. Its unique rheological properties were engineered and validated through extensive testing in collaboration with Mycronic to provide continuous and consistent deposits. NC257MD prolongs ejector life and reduces paste scrap and consumption. The superior wetting ability of NC257MD results in bright, smooth and shiny solder joints and reduced voiding on BGA and BTC devices. 257MD produces low post reflow flux residues, which remain crystal clear and easily probed even at the elevated temperatures required for lead-free alloys.CLEANING Post-Reflow Flux Residue: NC257MD residues can remain on the assembly after reflow and do not require cleaning. Where cleaning is mandated, AIM has worked closely with industry partners to ensure that NC257MD residues can be effectively removed with common defluxing agents. Contact AIM for cleaning compatibility information.